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Author: hli3276

碰到BGA封装的,25Xxx 芯片拆下来的连接方法

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Post time: 2015-10-24 20:14:31
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全是好方法,值得好好学习。
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Post time: 2015-10-24 21:14:03
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碰到BGA封装的25XXX 闪存,我一般是放弃。将闪存吹下来读写容易,可要将芯片再焊回去,那就麻烦了。要植球,再焊接。我感觉非常麻烦。

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Post time: 2015-10-27 19:10:34
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这个趋势要用bga的焊台
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Post time: 2015-11-1 22:37:50
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面对这个问题,还是准备U盘,买刷机包方便多了。
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Post time: 2015-11-9 20:08:18
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这个不难。我焊下这个IC.在置锡。焊上绝对不要10分钟。100%成功。
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Post time: 2015-11-9 21:26:25
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焊回去感觉比较难。
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Post time: 2015-11-12 20:40:32
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一碰到BGA要植球我就{:soso_e147:}
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Post time: 2015-11-15 15:37:59
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小罗--强辉电子 发表于 2015-10-13 17:47
碰到BGA封装的25XXX 闪存,我一般是放弃。将闪存吹下来读写容易,可要将芯片再焊回去,那就麻烦了。要植球 ...

同意同意。
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Post time: 2016-1-6 14:00:41
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值得好好学习
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