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Author: hli3276

碰到BGA封装的,25Xxx 芯片拆下来的连接方法

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Post time: 2015-10-14 17:18:27
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工具是越来越多了.............
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Post time: 2015-10-14 19:26:34
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取BGA用风枪吹下来,焊回去也用风枪的是高手啊,,,
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Post time: 2015-10-14 20:35:51
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这个应该不难,U盘FLASH 是BGA封装的也可以轻松搞定
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Post time: 2015-10-16 20:47:45
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植锡球用植锡板啊,出来的锡球很漂亮的
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Post time: 2015-10-24 06:08:33
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1470826206 发表于 2015-10-14 07:32
用风枪完全可以解决,就连的主板上的南北桥,我都用风枪,没问题

你能用风枪解决俺信,但要都能像你那样,俺无法信。
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Post time: 2015-10-24 06:12:58
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小罗--强辉电子 发表于 2015-10-14 08:34
我知道,肯定行。风枪不就是为了干这个的吗!我都用风枪吹过很多电视主板的BGA芯片。由于新芯片不用植球 ...

这个说得很实在,确实如此,要是平时在废旧板上练习,那可以考虑;但面对实际的好机器,不说这个险值不值得冒,就是这种麻烦值不值得去招惹都是个问题。
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Post time: 2015-10-24 12:38:01
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熱風槍我也有就是不太會用吹不下來也裝不上去
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 Author| Post time: 2015-10-24 19:35:22
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邱錦宙 发表于 2015-10-24 12:38
熱風槍我也有就是不太會用吹不下來也裝不上去

先拿料板练习,不要拿 好的来练习,不然,吹坏了,成本就高了,
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Post time: 2015-10-24 20:14:31
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全是好方法,值得好好学习。
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Post time: 2015-10-24 21:14:03
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碰到BGA封装的25XXX 闪存,我一般是放弃。将闪存吹下来读写容易,可要将芯片再焊回去,那就麻烦了。要植球,再焊接。我感觉非常麻烦。

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