BGA芯片植锡 锡球or锡浆

维修自由工作者

   由于现在的电视机主板使用BG封装的芯片太多了，大到主芯片，小到DDR 。几乎都是采用BGA了。原来的焊接技术已经落后了。所以没法子硬着头皮也要搞一搞BGA了。多次看了网站的BGA芯片焊接技巧的帖子。就是想问一下网友，现在植锡使用锡球好呢，还是用锡浆好呢。哪一个的成功率高一些呢。咱们修液晶电视常用的锡球有哪些规格，如果使用锡浆，哪个牌子的锡浆好用。盼高手给个意见。免得一开始路子就选错了。当然开始搞必须有个过程慢慢来。但还是希望借鉴你们的宝贵经验来增长我们作为新手的信心！

wim

I want to read in English so that I may understand clearly.

维修自由工作者

Because today's TV motherboards use too many BG encapsulated chips, from the main chip to the small DDR. It's almost always BGA. The original welding technology has fallen behind. So I can't get my head in the game and I'm gon na get some BGA. Read the website many times BGA chip welding skills posts. Just want to ask the Netizen, now use tin ball, or use tin paste good. Which is more successful. What specifications do we have to fix the tin ball used in LCD TV? If we use tin paste, which brand of tin paste is good? I'm looking forward to your advice. In case you picked the wrong path. Of course there's a process to start with. But I hope to learn from your valuable experience to increase our confidence as a novice!

维修自由工作者

Transferred online. Can you read it?

维修自由工作者

再翻译过来快面目全非了！

alibabaas

That would be a great topic i have same dilemma

冰刀一名

看不懂，正想搞一下是什么样的

冰刀一名

好像听人家说参有铜粉的锡高温好

昊天维修

呵呵 我是修电脑的 换个 桥芯片 显卡GPU 什么的 我用锡球的 重值球 无铅的 我自己搞维修 用 0.5 0.6 的多一些 关键 自己 要有BGA 返修台

ahsztiancl

小的芯片 包括EMMC 等  用锡浆好点速度快比锡珠好用，太小了。主芯片就要用锡珠了  ，不然焊点不饱满  。个人看法  也是论坛里看到别的师傅介绍的。